Semiconductor device packaging

Details Semiconductor device packaging Semiconductor device packaging

2006-03-10

2008-09-16

Toledo, Fernando L. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C438S113000, C438S125000, C438S126000, C438S127000

Reexamination Certificate

active

07425464

ABSTRACT:
Methods and apparatus are provided for encapsulating electronic devices, comprising: providing one or more electronic devices (62) with primary faces (63) having electrical contacts (69), opposed rear faces (65) and edges (64) therebetween. A sacrificial layer (70) is provided on the primary faces (63). The devices (62) are mounted on a temporary support (80) so that the sacrificial layer (70) faces toward the temporary support (80). A plastic encapsulation (86)is formed in contact with at least the lateral edges (64) of the electronic devices (62). The plastic encapsulation (86) is at least partially cured and the devices (62) and plastic encapsulation (86) separated from the temporary support (80), thereby exposing the sacrificial layer (70). The sacrificial layer (70) is removed. The devices (62) and edge-contacting encapsulation are mounted on a carrier (90) with the primary faces (63) and electrical contacts (69) exposed and, optionally, further cured. Insulators (94) and conductors (96) applied to the primary faces couple electrical contacts (69) on various devices (62) to each other and to external contacts, thereby forming an integrated multi-device panel (88″).

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