Semiconductor device packages with substrates for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Reexamination Certificate

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C257SE23026, C257SE23039, C257SE23094, C257SE23066, C257SE23067, C257SE23068, C257SE23092, C257SE23101, C257SE25016, C257S666000, C257S698000, C257S696000, C257S778000, C257S738000, C257S734000, C257S737000

Reexamination Certificate

active

07745930

ABSTRACT:
A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.

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patent: 2006/0238067 (2006-10-01), Dausch
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International Search Report dated Aug. 30, 2007 for PCT/US06/15376.
International Search Report dated Aug. 8, 2006 for PCT/US06/15377.

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