Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...
Reexamination Certificate
2009-04-14
2010-11-09
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
With means to shield device contained in housing or package...
C257S659000, C257SE21499, C438S118000
Reexamination Certificate
active
07829981
ABSTRACT:
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit defining a cut-out portion disposed adjacent to a periphery of the substrate unit; (2) a grounding element disposed in the cut-out portion and at least partially extending between an upper surface and a lower surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body. The EMI shield is electrically connected to a connection surface of the grounding element, such that the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
REFERENCES:
patent: 4569786 (1986-02-01), Deguchi
patent: 4814205 (1989-03-01), Arcilesi et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5557142 (1996-09-01), Gilmore et al.
patent: 5677511 (1997-10-01), Taylor et al.
patent: 5886876 (1999-03-01), Yamaguchi
patent: 6376769 (2002-04-01), Chung
patent: 6686649 (2004-02-01), Matthews et al.
patent: 6740959 (2004-05-01), Alcoe et al.
patent: 6881896 (2005-04-01), Ebihara
patent: 7045385 (2006-05-01), Kim et al.
patent: 7161252 (2007-01-01), Tsuneoka et al.
patent: 7187060 (2007-03-01), Usui
patent: 7327015 (2008-02-01), Yang et al.
patent: 7342303 (2008-03-01), Berry et al.
patent: 2004/0020673 (2004-02-01), Mazurkiewicz
patent: 2004/0231872 (2004-11-01), Arnold et al.
patent: 2005/0013082 (2005-01-01), Kawamoto et al.
patent: 2005/0045358 (2005-03-01), Arnold
patent: 2006/0145361 (2006-07-01), Yang et al.
patent: 2008/0042301 (2008-02-01), Yang et al.
patent: 2008/0061407 (2008-03-01), Yang et al.
patent: 2008/0174013 (2008-07-01), Yang et al.
patent: 08-288686 (1996-01-01), None
patent: WO 2004/060034 (2004-07-01), None
Advanced Semiconductor Engineering Inc.
Cooley LLP
Potter Roy K
LandOfFree
Semiconductor device packages with electromagnetic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device packages with electromagnetic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device packages with electromagnetic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4218267