Semiconductor device packaged into chip size and...

Details Semiconductor device packaged into chip size and... Semiconductor device packaged into chip size and...

2011-01-11

2011-01-11

Dang, Trung (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21599, C257SE23126

Reexamination Certificate

active

07867826

ABSTRACT:
A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with the connection pad. A first sealing material is provided on the semiconductor substrate around the external connection electrode, each impurity concentration of an Na ion, a K ion, a Ca ion and Cl ion contained in the first sealing material being not greater than 10 ppm. A second sealing material is provided on at least one of a lower surface and a peripheral side surface of the semiconductor substrate, a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion contained in the second sealing material being not smaller than 100 ppm.

REFERENCES:
patent: 4472730 (1984-09-01), Ohta
patent: 5049596 (1991-09-01), Fujimoto et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 6034421 (2000-03-01), Tokunaga
patent: 6316832 (2001-11-01), Tsuzuki et al.
patent: 6391687 (2002-05-01), Cabahug et al.
patent: 6744124 (2004-06-01), Chang et al.
patent: 6770971 (2004-08-01), Kouno et al.
patent: 6777263 (2004-08-01), Gan et al.
patent: 7274101 (2007-09-01), Tomita et al.
patent: 2007/0247821 (2007-10-01), Kobayakawa et al.
patent: 2001-332643 (2001-11-01), None
patent: 552667 (2003-09-01), None
patent: 561597 (2003-11-01), None
patent: 586192 (2004-05-01), None

Affiliated with

Also associated with

Rating

Semiconductor device packaged into chip size and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device packaged into chip size and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device packaged into chip size and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2695940