Semiconductor device package with small die pad and method of ma

Details Semiconductor device package with small die pad and method of ma Semiconductor device package with small die pad and method of ma

1994-06-10

1997-04-22

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29841, 29827, 257676, 257787, H01L 2328

Patent

active

056231237

ABSTRACT:
Semiconductor device package 53 having a lead frame with a mounting pad 31 smaller than the IC chip 10 mounted thereon, and a method of making a semiconductor device package based on wire bonding using a heater insert 38 with a mounting pad insertion concave part 51. Separation between the mounting pad and an encapsulating resin is eliminated, cracks are not created in the resin, or are considerably reduced, and warpage of the package can be prevented. Also, bonding of wires between leads and respective bonding pads 17 on the chip 10can be executed stably and efficiently.

REFERENCES:
patent: 4857989 (1989-08-01), Mori et al.
patent: 5182630 (1993-01-01), Omi et al.
patent: 5237205 (1993-08-01), Newman
patent: 5334803 (1994-08-01), Yamamura et al.

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