Semiconductor device package with shaped parts for direct coupli

Details Semiconductor device package with shaped parts for direct coupli Semiconductor device package with shaped parts for direct coupli

1992-10-13

1995-05-02

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257697, 439620, H01L 2348, H01L 2941, H01L 2952, H01L 2960

Patent

active

054122481

ABSTRACT:
A packaging structure is disclosed for a semiconductor device, having a body configured to include at least one part provided with contact terminals and shaped to form a connector member for direct coupling to a standard connector member from an external circuit. A connector assembly is also disclosed which is fully sealed from moisture and comprises the packaging structure.

REFERENCES:
patent: 4239319 (1980-12-01), Gladd et al.
patent: 4675718 (1987-06-01), Tsubokura et al.
patent: 4985310 (1991-01-01), Agarwala et al.
patent: 5108300 (1992-04-01), Weber

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