Semiconductor device package with metal-polymer joint of control

Details Semiconductor device package with metal-polymer joint of control Semiconductor device package with metal-polymer joint of control

1992-12-21

1999-12-14

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

With textured surface

257796, 257706, H01L 2348, H01L 2328, H01L 2310

Patent

active

06002173&

ABSTRACT:
A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).

REFERENCES:
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 5041902 (1991-08-01), McShane
patent: 5278429 (1994-01-01), Tanenaka et al.

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