Semiconductor device package with dies mounted on both sides of

Details Semiconductor device package with dies mounted on both sides of Semiconductor device package with dies mounted on both sides of

1990-03-14

1991-07-23

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437216, 437217, 437220, 29827, 26427217, H01L 2160

Patent

active

050343505

ABSTRACT:
A semiconductor device in a plastic or ceramic package contains at least one silicon die on each side of a central die pad of a single metal frame, thus allowing a substantial space saving on the printed circuit assembly card.
The bonding of the silicon dies and the soldering of the connecting wires are performed on both sides of the frame by emplying a special slotted clamp fixture inside which a strip of frames is clamped during these assembly operations and relative quality control operations.

REFERENCES:
patent: 3597666 (1971-08-01), Taskovich et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4529667 (1985-07-01), Shiga et al.
patent: 4637130 (1987-01-01), Fujii et al.

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