Semiconductor device package with circuit board and resin

Details Semiconductor device package with circuit board and resin Semiconductor device package with circuit board and resin

1989-01-09

1990-11-27

Mintel, William

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 54, 357 80, 357 69, 357 74, 357 75, 174 522, H01L 2328

Patent

active

049740571

ABSTRACT:
A semiconductor device package having a semiconductor element of elements sealed in resin wherein a plurality of resin types different in function are used for sealing in which the more expensive resins are selectively used in forming thin covering layers for the semiconductor element and other components of the device, and the less expensive resin is used in a larger amount as an outer cover of a molded package. In another aspect of the semiconductor device package, bonding pads are provided at least in the active region of the semiconductor element or elements for wireless bonding of the semiconductor element to a circuit board. A stacked type semiconductor device package is also proposed wherein a plurality of semiconductor devices are stacked one atop the other, at least one of which has outer leads of longer length than the outer leads of the other semiconductor devices.

REFERENCES:
patent: 3611317 (1971-10-01), Bonfeld
patent: 3893156 (1975-07-01), Riseman
patent: 4122479 (1978-10-01), Sugawara et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4396457 (1983-08-01), Bakermans
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4785137 (1988-01-01), Samuels
patent: 4788583 (1988-11-01), Kawahara et al.
Bodendorf et al, "Active Silicon Chip Carrier", IBM Technical Disclosure Bulletin, vol. 15, No. 2, Jul. 1972, pp. 656-657.
Dion et al, "Module Package", IBM Technical Disclosure Bulletin, vol. 7, No. 7, Dec. 1964, p. 557.
Farrell et al, "Protective Coating for Devices on Encapsulated Modules", IBM Technical Disclosure Bulletin, vol. 8, No. 12, May 1966, p. 1705.

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