Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-12-29
2009-02-03
Clark, S. V (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S118000, C257S707000, C257S783000
Reexamination Certificate
active
07485496
ABSTRACT:
A semiconductor package with a heat sink and a method for fabricating the same are proposed. A first adhesive of a low Young's modulus is disposed on a corner region of a heat sink mounting area of a substrate. A second adhesive of a high Young's modulus is disposed on the heat sink mounting area except the corner region. The heat sink is mounted on the heat sink mounting area and thereby secured in position to the substrate, by the first and second adhesives. The disposition of the first and second adhesives of different Young's moduli not only prevents detachment of the heat sink from the substrate, but also controls the flatness of the heat sink. The prevent invention does not affect the appearance of the semiconductor package and its ensuing assembly process.
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Chien Kun-Sheng
Chiu Shih-Kuang
Hsiao Cheng-Hsu
Pu Han-Ping
Clark S. V
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
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