Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or... – Molding pressure control means responsive to pressure at...
Reexamination Certificate
2006-08-15
2006-08-15
Everhart, Caridad M. (Department: 2891)
Plastic article or earthenware shaping or treating: apparatus
Control means responsive to or actuated by means sensing or...
Molding pressure control means responsive to pressure at...
C257SE23066, C257SE23120, C257SE23107
Reexamination Certificate
active
07090482
ABSTRACT:
A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is cut.
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Akiguchi Takashi
Miyakawa Hidenori
Tsukahara Norihito
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