Semiconductor device package manufacturing method and...

Details Semiconductor device package manufacturing method and... Semiconductor device package manufacturing method and...

2006-08-15

2006-08-15

Everhart, Caridad M. (Department: 2891)

Plastic article or earthenware shaping or treating: apparatus

Control means responsive to or actuated by means sensing or...

Molding pressure control means responsive to pressure at...

C257SE23066, C257SE23120, C257SE23107

Reexamination Certificate

active

07090482

ABSTRACT:
A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is cut.

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