Semiconductor device package having regions of different thermal

Details Semiconductor device package having regions of different thermal Semiconductor device package having regions of different thermal

1984-11-13

1986-07-15

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 357 81, H05K 720

Patent

active

046009680

ABSTRACT:
In the particular embodiments of the invention described in the specification, a semiconductor package is made from two modules, one containing a semiconductor element having a high allowable temperature and the other containing a circuit component having a lower allowable temperature. The modules are combined by corresponding embossed and recessed surfaces or by pin connection or by a connecting screw.

REFERENCES:
patent: 2976806 (1961-03-01), Risk
patent: 3054024 (1962-09-01), Van Dillen
patent: 3267334 (1966-08-01), Wule
patent: 3290559 (1966-12-01), Kirby
patent: 3555364 (1971-01-01), Matcovich
patent: 3723833 (1973-03-01), Wheatley, Jr.
patent: 4423465 (1983-12-01), Teng-Ching
IBM Tech. Discl. Bull., vol. 27, No. 4B, Sep. 1984, p. 2389, "Stackable Plastic Semiconductor Chip Carrier", Robock.

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