Semiconductor device package having locating mechanism for prope

Details Semiconductor device package having locating mechanism for prope Semiconductor device package having locating mechanism for prope

1993-02-12

1994-05-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361748, 361784, 361807, 174 1705, 174 524, 174259, 257686, 257779, 439 65, H05K 702

Patent

active

053114027

ABSTRACT:
A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.

REFERENCES:
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5132875 (1992-07-01), Plesinger
patent: 5136469 (1992-08-01), Carusillo et al.

Affiliated with

Also associated with

Rating

Semiconductor device package having locating mechanism for prope does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package having locating mechanism for prope, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package having locating mechanism for prope will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2416256