Semiconductor device package fabrication method and apparatus

Details Semiconductor device package fabrication method and apparatus Semiconductor device package fabrication method and apparatus

1995-03-27

1997-03-11

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257777, 257778, 257706, H01L 2328, H01L 2310, H01L 2348

Patent

active

056104421

ABSTRACT:
A planar substrate is attached to a face of a semiconductor die. The semiconductor die is electrically connected to a printed wiring board and encapsulation material covers the peripheral edges of the planar substrate, semiconductor die, and means for interconnecting the die and printed wiring board. An exterior face of the planar substrate remains exposed and may be utilized in pick and place automatic assembly. The exterior face of the planar substrate may also be utilized for attachment of an external heat sink for improved heat transfer from the semiconductor device. The planar substrate may be comprised of silicon, ceramic, metal or any other stiff material so long as the temperature coefficient of expansion is similar to that of the semiconductor die. A flip-chip semiconductor die may also be utilized without a planar substrate wherein the nonactive face of the die is exposed.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 5157478 (1992-10-01), Ueda et al.
patent: 5357672 (1994-10-01), Newman
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5455457 (1995-10-01), Kurokawa
"Electronic Packaging & Interconnection Handbook", pp. 7.24-7.27, C. Harper .

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