Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-10-17
2006-10-17
Tran, Thien F. (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S127000, C438S725000
Reexamination Certificate
active
07122406
ABSTRACT:
Embodiments in accordance with the present invention relate to the fabrication of packages for semiconductor devices, and in particular to the use of electroplating techniques to form features on the surface of a metal lead frame. In accordance with one embodiment, electroplating is used to fabricate non-integral pin portions shaped to remain securely encapsulated within the plastic molding of the package. In accordance with another embodiment, electroplating may be used to fabricate protrusions on the underside of the lead frame for elevating the package above the PC board, thereby preserving the rounded shape of solder balls used to secure the diepad to the PC board. In accordance with yet another embodiment, electroplating may be used to fabricate raised patterns on the upper surface of the diepad for ensuring uniform spreading of adhesive used to secure the die to the diepad, thereby ensuring level attitude of the die within the package.
REFERENCES:
patent: 5172214 (1992-12-01), Casto
patent: 6143981 (2000-11-01), Glenn
patent: 6355502 (2002-03-01), Kang et al.
patent: 6420779 (2002-07-01), Sharma et al.
patent: 6437429 (2002-08-01), Su et al.
patent: 6476478 (2002-11-01), Swiss et al.
patent: 6583499 (2003-06-01), Huang et al.
patent: 6630728 (2003-10-01), Glenn
Duffek et al., “Etching in Printed Circuit Handbook”, Chapter 6 C.F. Coombs, Ed. (McGraw-Hill, New York, 1967).
ORBIS Technologies, Ltd., Drilling & De-Smearing Flexible Printed Circuits, http://www.orbitech.col.uk/appst01.html, printed Aug. 17, 2004.
SIGMA, Etching Process, http://www.sigma-mecer.com/chem..html, printed Aug. 17, 2004.
Chia Anthony
Fujimaki Seishi
Yilmaz Hamza
Zeng Xiaoguang
GEM Services, Inc.
Tran Thien F.
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