Patent
1990-05-31
1991-12-24
Mintel, William
357 69, 357 72, H01L 2348
Patent
active
050757601
ABSTRACT:
A flexdible film substrate carries a pattern of conductive leads and mounting pads. The conductive leads have outer lead portions, and inner lead portions which terminate near to the mounting pads. Semiconductor chips are mounted face-up on the mounting pads and connected by wire-bond connections to the inner lead portions. A transfer molding process is used to encapsulate the semiconductor device assemblies leaving the outer lead portions protruding from the encapsulated material. The flexible film substrate supports the mounting pads and conductive leads during the wire-bonding and transfer molding operations.
REFERENCES:
patent: 4006047 (1983-02-01), Brummett et al.
patent: 4477827 (1984-10-01), Walker et al.
patent: 4661837 (1987-04-01), Sono
patent: 4706105 (1987-11-01), Masuda et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4772936 (1988-09-01), Reding et al.
patent: 4884124 (1989-11-01), Mori et al.
Japanese Kokai Patent No. Sho 58[1983]-178544, Marutsuka et al., Oct. 19, 1983.
Nabeta Hiroto
Nakashima Takashi
Donaldson Richard
Hiller William E.
Loke Steven
Mintel William
Texas Instruments Incorporated
LandOfFree
Semiconductor device package assembly employing flexible tape does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device package assembly employing flexible tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package assembly employing flexible tape will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-47900