Semiconductor device package and packaging method

Details Semiconductor device package and packaging method Semiconductor device package and packaging method

1986-11-07

1990-08-28

Hille, Rolf

357 77, 357 76, H01L 2312, H01L 2304

Patent

active

049530011

ABSTRACT:
A semiconductor device package is provided to enclose a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric and a semiconductor device having an electrode contact thereof bonded to the strip conductor by a conductive interconnect, such package having a bottom portion and a top portion hermetically sealed together along a conductive surface, such strip conductor being spaced between the conductive surface and the conductive interconnect. A method of packaging a semiconductor device and a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric with such strip conductor bonded to an electrode contact of the semiconductor device, such method comprising the step of hermetically sealing a top portion of the package to a bottom portion of the package along a conductive surface, the strip conductor being between the semiconductor device and the conductive surface. With such arrangement and method the conductive surface providing the hermetic seal between the top and bottom portion of the package after the contact electrode of the semiconductor device has been bonded to the strip conductor of the microstrip transmission line appears as a part of the ground plane conductor to thereby reduce unwanted electrical resonances which would result in a package having a more limited operating bandwidth.

REFERENCES:
patent: 3767979 (1973-10-01), Reber et al.
patent: 3936778 (1976-02-01), De Ronde

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