Semiconductor device package and method thereof

Details Semiconductor device package and method thereof Semiconductor device package and method thereof

1984-11-19

1986-11-11

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 2191171, 357 74, H05K 503

Patent

active

046224343

ABSTRACT:
Packaging of discrete semiconductor devices is improved by dimpling metal caps prior to assembly onto headers and welding.
The dimpled caps provide a friction fit to the headers, whereby fewer assembled, but unwelded packages separate during handling. The dimples are more economical and more reliable than prior art crimps which perform a similar function.

REFERENCES:
patent: Re26899 (1970-05-01), Dion et al.
patent: 3211827 (1965-10-01), Trueb et al.
patent: 4456334 (1984-06-01), Henry et al.

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