Semiconductor device package and method of manufacture

Details Semiconductor device package and method of manufacture Semiconductor device package and method of manufacture

2006-06-06

2006-06-06

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S125000, C438S126000, C438S127000, C257S787000

Reexamination Certificate

active

07056765

ABSTRACT:
A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.

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