Semiconductor device package and method of making a...

Details Semiconductor device package and method of making a... Semiconductor device package and method of making a...

2008-02-01

2011-12-27

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C257S666000, C257SE23031, C257SE23043

Reexamination Certificate

active

08084299

ABSTRACT:
A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.

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