Semiconductor device package and method of making

Details Semiconductor device package and method of making Semiconductor device package and method of making

1995-01-19

1995-11-21

Phillips, Michael W.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

26427217, 257704, 361718, 361764, 361783, H01L 2328, H01L 2312, H05K 720, H05K 118

Patent

active

054689104

ABSTRACT:
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the supportive substrate (10, 12), over the semiconductor die (16). The protective lid (20) is partially encapsulated with molding compound (28). The protective lid (20) prevents the molding compound (30) from contacting the semiconductor die (16), and associated wirebonded wires (18). A portion (30) of the protective lid (20) remains exposed. Thus, a molded package compatible with current product designs and assembly processes is provided, yet disadvantages caused by molding compound contacting the die (16) and wires (18) are avoided. Furthermore, the exposed protective lid (30) provides superior heat dissipation for the package.

REFERENCES:
patent: 3292050 (1966-12-01), Grossoehme
patent: 3469148 (1969-09-01), Lund
patent: 3735211 (1973-05-01), Kapnias
patent: 3745422 (1973-07-01), Carnes
patent: 3874549 (1975-04-01), Hascoe
patent: 4114177 (1978-09-01), King
patent: 5108955 (1992-04-01), Ishida
patent: 5120678 (1992-06-01), Moore et al.
patent: 5157478 (1992-10-01), Ueda et al.

Affiliated with

Also associated with

Rating

Semiconductor device package and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1138726