Semiconductor device package and manufacturing method thereof

Details Semiconductor device package and manufacturing method thereof Semiconductor device package and manufacturing method thereof

2005-01-05

2009-12-15

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

Reexamination Certificate

active

07633170

ABSTRACT:
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.

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patent: WO 2004060034 (2003-12-01), None
patent: WO 2004/060034 (2004-07-01), None

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