Semiconductor device package and manufacturing method

Details Semiconductor device package and manufacturing method Semiconductor device package and manufacturing method

2007-09-07

2010-02-02

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

Reexamination Certificate

active

07656047

ABSTRACT:
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.

REFERENCES:
patent: 4569786 (1986-02-01), Deguchi
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5677511 (1997-10-01), Taylor et al.
patent: 6376769 (2002-04-01), Chung
patent: 6686649 (2004-02-01), Mathews et al.
patent: 6740959 (2004-05-01), Alcoe et al.
patent: 7187060 (2007-03-01), Usui
patent: 2004/0020673 (2004-02-01), Mazurkiewicz
patent: 2004/0231872 (2004-11-01), Arnold et al.
patent: 2005/0013082 (2005-01-01), Kawamoto et al.
patent: 2005/0045358 (2005-03-01), Arnold
patent: WO 2004060034 (2003-12-01), None

Affiliated with

Also associated with

Rating

Semiconductor device package and manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device package and manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device package and manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4231829