Semiconductor device package

Details Semiconductor device package Semiconductor device package

1978-03-08

1980-02-26

Reynolds, Bruce A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 52S, 357 74, 357 80, H05K 506

Patent

active

041907353

ABSTRACT:
A semiconductor device package comprises a plurality of walls extending from a base member which has a pellet mounting surface associated therewith. The walls form an enclosure and each one of the walls has a lid receiving surface associated therewith. All of the lid receiving surfaces lie in a single geometric plane which intersects the geometric plane of the pellet mounting surface at an included angle of less than about 90.degree.. External leads protrude into the enclosures through one of the walls. A lid can be affixed to the lid receiving surfaces to hermetically seal the enclosure. The package is particularly useful when made to conform to the dimensions of the well known TO-220 package.

REFERENCES:
patent: 929865 (1909-08-01), Mahoney
patent: 3146410 (1964-08-01), Butler
patent: 3410582 (1968-11-01), Appleton
patent: 3548076 (1970-12-01), Cooke
patent: 3562404 (1971-02-01), Satriano
patent: 3601667 (1971-08-01), Desmond
patent: 3937389 (1976-02-01), Wind
patent: 4067040 (1978-01-01), Tsuzuki et al.

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