Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Intervalley transfer
Patent
1996-05-21
1999-01-19
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Bulk effect device
Intervalley transfer
257700, 257738, 257780, 438613, H01L 2348, H01L 2352, H01L 2940, H01L 2312
Patent
active
058616705
ABSTRACT:
An integrated circuits package or a chip carrier having an integrated circuits chip sealed therein comprises layers of ceramic substrates, and terminal steps which are connected to inner pads in contact with the integrated circuits chip and which are provided on the bottom surface of at least one layer of the package, preferably the lowermost layer. The terminal steps are provided in a lattice arrangement, with so many rows of terminal steps as equals the number of terminal steps in one row, thus enabling connection of all of the terminals of the chip to outside wirings, such as wirings of a mother board.
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"Bumps and Balls, Pillars and Beams: a Survey of Face-Bonding Methods" George Sideris, Electronics Jun. 28, 1965 pp. 68-69.
"Distribution System for Multilayer Ceramic Modules" Z. Markewycz, IBM Technical Disclosure Bulletin vol. 19, No. 4, Sep. 1976, pp. 1270-1271.
IBM Technical Disclosure Bulletin, vol. 15, No. 6, pp. 1977-1980, Nov. 1972, "Packaging of Integrated Circuits" C. M. McIntosh and A.F. Schmeckenbecher.
Fujitsu Limited
Saadat Mahshid
Wilson Allan R.
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