Semiconductor device package

Details Semiconductor device package Semiconductor device package

1990-02-20

1992-02-11

LaRoche, Eugene R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 72, 357 80, 174 524, H01L 2348, H01L 2328, H01L 3902

Patent

active

050879618

ABSTRACT:
A semiconductor device assembly is made without a molded package by using a tape having a patterned insulating layer and a conductive layer joined thereto. A semiconductor die is seated on the conductive layer and electrically connected to leads of the patterned conductive layer. A body frame is positioned around the die and electrical leads and connections, and an encapsulant material is distributed over the frame and within the frame over the die and electrical leads and connections.

REFERENCES:
patent: 3811183 (1974-05-01), Celling
patent: 4867686 (1989-09-01), Goldstein

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