Semiconductor device package

Details Semiconductor device package Semiconductor device package

2006-10-25

2009-12-08

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

C257S730000, C257SE23002

Reexamination Certificate

active

07629685

ABSTRACT:
Disclosed is a semiconductor device package. The semiconductor device package includes at least one semiconductor device acting as a heating source, a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at least having a higher heat conductivity than that of the semiconductor device, and a fiber-reinforced polymer composite formed to surround a side surface of the package substrate, the polymer composite including fibers acting as a reinforcing material and a resin mass embedding the fibers therein.

REFERENCES:
patent: 2003/0003287 (2003-01-01), Tobita
patent: 2003/0168720 (2003-09-01), Kamada

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