Semiconductor device package

Details Semiconductor device package Semiconductor device package

2005-11-01

2005-11-01

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

06960493

ABSTRACT:
An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.

REFERENCES:
patent: 5136366 (1992-08-01), Worp et al.
patent: 5255157 (1993-10-01), Hegel
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5736789 (1998-04-01), Moscicki
patent: 5773895 (1998-06-01), Hassan et al.
patent: 5841192 (1998-11-01), Exposito
patent: 5909054 (1999-06-01), Kozono
patent: 6214643 (2001-04-01), Chiu

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