Semiconductor device package

Details Semiconductor device package Semiconductor device package

2005-04-19

2005-04-19

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C361S752000, C361S753000, C361S816000

Reexamination Certificate

active

06881896

ABSTRACT:
A semiconductor device package includes a substrate, a semiconductor device formed on the substrate, a ground electrode formed on the substrate, a cover designed for covering the semiconductor device, and a tab unit extending from the cover and for holding the substrate. The cover has an outer surface made of conductive material and an inner surface made of insulation material, where the insulating inner surface faces the semiconductor device. The tab unit has a first contact surface which extends from the conductive outer surface and is contact with the ground electrode.

REFERENCES:
patent: 4218578 (1980-08-01), Olschewski et al.
patent: 5757251 (1998-05-01), Hashinaga et al.
patent: 5838551 (1998-11-01), Chan
patent: 5959842 (1999-09-01), Leonard et al.
patent: 6768654 (2004-07-01), Arnold et al.
patent: 1-165650 (1989-11-01), None
patent: 3-65299 (1991-06-01), None
patent: 5-175351 (1993-07-01), None
patent: 8-136771 (1996-05-01), None
patent: 9-51183 (1997-02-01), None
patent: 10-41665 (1998-02-01), None

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