Semiconductor device mounting structure, manufacturing...

Details Semiconductor device mounting structure, manufacturing... Semiconductor device mounting structure, manufacturing...

2011-06-28

2011-06-28

Wagner, Jenny L. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

C257SE23135

Reexamination Certificate

active

07969028

ABSTRACT:
A semiconductor device mounting structure includes a semiconductor device whose electrodes are aligned on its one main face; a circuit board having board electrodes electrically connected to the electrodes of the semiconductor device by solder bumps; and curable resin applied between at least the side face of the semiconductor device and the circuit board. Multiple types of thermally expandable particles with different expansion temperatures are mixed in this curable resin. This structure offers the semiconductor device mounting structure that is highly resistant to impact and suited for mass production, its manufacturing method, and a removal method of the semiconductor device. In addition, this structure facilitates repair and reworking, leaving almost no adhesive residue on the circuit board after repair. Stress applied to the circuit board during repair can also be minimized.

REFERENCES:
patent: 5981313 (1999-11-01), Tanaka
patent: 6335571 (2002-01-01), Capote et al.
patent: 6373142 (2002-04-01), Hoang
patent: 7323360 (2008-01-01), Gonzalez et al.
patent: 2008/0308930 (2008-12-01), Yoshida
patent: 2001-107019 (2001-04-01), None
patent: 2005-332970 (2005-12-01), None
patent: 2006-100457 (2006-04-01), None
United States Office Action issued in U.S. Appl. No. 12/106,459 dated Mar. 9, 2010.
U.S. Office Action issued in U.S. Appl. No. 12/106,459, mailed on Jul. 29, 2010.
U.S. Office Action issued in U.S. Appl. No. 12/106,459, mailed on Mar. 9, 2010.
Related U.S. Appl. No. 12/106,459 to Yokota, filed Apr. 21, 2008, entitled “Electronic Device and Manufacturing Method”.

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