Semiconductor device mounting and multi-chip module

Details Semiconductor device mounting and multi-chip module Semiconductor device mounting and multi-chip module

1996-06-14

1998-09-01

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257686, 257678, 257723, H01L 2302, H01L 2334

Patent

active

058014381

ABSTRACT:
In a multi-chip module, a laminate wiring board is formed with stepped recesses. Electrodes to be connected to the electrodes of a bare-chip semiconductor device are subjected to non-electrolytic gold plating. This realizes wire bonding which is as short in distance and as low in loop as possible. To seal each recess with insulating resin, use is made of screen printing using a mesh screen which has a great aperture ratio and a small thickness.

REFERENCES:
patent: 4903120 (1990-02-01), Beene et al.
patent: 4943844 (1990-07-01), Oscilowski et al.
patent: 4993148 (1991-02-01), Adachi et al.
patent: 5313367 (1994-05-01), Ishiyama
patent: 5608262 (1997-03-01), Degani et al.

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