Semiconductor device-mounted on a printed circuit board having s

Details Semiconductor device-mounted on a printed circuit board having s Semiconductor device-mounted on a printed circuit board having s

1998-03-27

2000-09-19

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257737, 257738, 257778, 22818022, 438 15, 438615, H01L 2158, G01R 3127

Patent

active

061221775

ABSTRACT:
In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.

REFERENCES:
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patent: 4921550 (1990-05-01), McLellan
patent: 5012502 (1991-04-01), Battin et al.
patent: 5040281 (1991-08-01), Sumiyoshi
patent: 5216278 (1993-06-01), Lin et al.
patent: 5877079 (1999-03-01), Karasawa et al.
patent: 5878943 (1999-03-01), Nishikawa et al.
Nikkei Electronics, No. 601, pp. 59-73, Feb. 1994.

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