Semiconductor device mounted in a highly flexible, segmented pac

Details Semiconductor device mounted in a highly flexible, segmented pac Semiconductor device mounted in a highly flexible, segmented pac

1987-07-14

1989-12-12

Hille, Rolf

357 79, 357 74, H01L 2330, H01L 2328, H01L 2334

Patent

active

048871494

ABSTRACT:
A package for semiconductor devices provided with an encased metallic heat sink, wherein an encapsulating body of resin extends beyond the perimenter of the heat sink to form two side extensions, diametrically opposite with respect to a central portion of the body and elastically de-coupled from such a central portion of the resin body containing the heat sink and the semiconductor chip, by means of at least a thinned out zone of the resin body determined by one or more pairs of opposite grooves. Fastening points contemplated in said lateral extensions, are efficiently elastically de-coupled from the central portion of the body and the package is essentially free to blend along said pairs of opposite grooves without inducing stresses on the encased metallic heat sink onto which rests the semiconductor chip.

REFERENCES:
patent: 3839660 (1974-10-01), Stryker
patent: 4100566 (1978-07-01), Okikawa et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4361720 (1982-11-01), Resneau et al.
patent: 4577387 (1986-03-01), Kaufman
patent: 4777520 (1988-10-01), Nambu et al.

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