Semiconductor device molded in plastic package free from crack b

Details Semiconductor device molded in plastic package free from crack b Semiconductor device molded in plastic package free from crack b

1997-03-18

1999-03-16

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257791, 257792, 257793, H01L 2328, H01L 2329

Patent

active

058834397

ABSTRACT:
A semiconductor chip is mounted on a die pad of a lead-frame, and the semiconductor chip mounted on the die pad is sealed in a plastic package; a side surface of the semiconductor chip and an exposed upper surface and a side surface of the die pad are covered with an organic stress relaxation layer so as to reduce a thermal stress due to the difference in thermal expansion coefficient between the semiconductor chip and the die pad, thereby presenting the plastic package from a crack.

REFERENCES:
patent: 5287003 (1994-02-01), Van Andel et al.
Fracture Properties Of Molding Compound Materials For IC Plastic Packaging; John Sauber et al.; Part A. vol.17, No. 4 Dec. 1994 pp. 533-541.
Interface Crack Analysis On Surface With Dimples In LSI Package; Mitsuru Sato; pp. 74-79.

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