Semiconductor device module structure

Details Semiconductor device module structure Semiconductor device module structure

2004-11-30

2010-02-16

Gurley, Lynne A. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S499000, C257S500000, C257S678000, C257S712000, C257S713000, C257S718000, C257S719000, C257S720000, C438S133000, C438S309000, C438S328000

Reexamination Certificate

active

07663220

ABSTRACT:
A semiconductor module includes: a semiconductor element (13) having a working unit (11) and a guard ring unit (12); and heat radiation members (15, 14) arranged on an upper surface and a lower surface of the semiconductor element for cooling the semiconductor element. A passivation film (20) covers the guard ring but does not cover the working unit. The upper heat radiation member (15) is made of a flat metal plate connected to the working unit without contact with the passivation film. The upper heat radiation member is connected to the lower heat radiation member (14) in the thermo-conducting way.

REFERENCES:
patent: 6703707 (2004-03-01), Mamitsu et al.
patent: 2003/0052400 (2003-03-01), Okura et al.
patent: 2003/0122232 (2003-07-01), Hirano et al.
patent: 2004/0066630 (2004-04-01), Whittenburg et al.
patent: 2004/0118501 (2004-06-01), Chiu et al.
patent: 2004/0195649 (2004-10-01), Miura et al.
patent: 2000-124398 (2000-04-01), None
patent: 2000-156439 (2000-06-01), None
patent: 2002-033445 (2002-01-01), None

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