Semiconductor device module

Details Semiconductor device module Semiconductor device module

2005-06-14

2005-06-14

Le, Que T. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C250S214100

Reexamination Certificate

active

06906316

ABSTRACT:
A semiconductor device module is provided that prevents adhesion defects from causing in bonding a semiconductor sensor chip to a sensor stage with an adhesive and improving the reliability thereof. The semiconductor device module includes a sensor stage and a semiconductor optical sensor chip mounted on the sensor stage. The sensor stage includes a U-groove formed in an upper central surface portion of a bottom wall thereof. The sensor chip is bonded to the sensor stage with a thermosetting and UV-curing adhesive coated in the U-groove. The U-groove, includes an island-shaped flat pedestal located at a central bottom portion of the U-groove for mounting the sensor chip thereon. Pins are preferably disposed on both sides of the pedestal to hold the sensor chip horizontally, and the side walls of the U-groove3bare preferably slanted such that the adhesive coated in the U-groove is prevented from splashing to the outside.

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U.S. Appl. No. 09/455,937; filed Dec. 7, 1999; Semiconductor Optical Sensing Apparatus.

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