Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2005-01-04
2005-01-04
Pham, Long (Department: 2814)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C156S922000, C118S7230AN, C118S728000, C118S729000
Reexamination Certificate
active
06837963
ABSTRACT:
A semiconductor device producing method that can clean an edge part of a semiconductor substrate with certainty is provided. The method of producing a semiconductor device includes a step of generating ions and a step of accelerating the ions by means of an electric field and radiating an ion flow onto an edge part of a semiconductor substrate to clean the edge part of the semiconductor substrate. The semiconductor substrate is moved relative to the ion flow while maintaining a state in which the ion flow is being radiated onto the edge part. The step of generating ions includes applying a high-frequency voltage between a pair of electrodes to generate the ions between the electrodes.
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Asaoka Yasuhiro
Muranaka Seiji
Nagai Toshihiko
Tanaka Hiroshi
Yokoi Naoki
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Pham Long
Rao Shrinivas H
Renesas Technology Corp.
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