Semiconductor device, method of producing a semiconductor...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant

Reexamination Certificate

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C156S922000, C118S7230AN, C118S728000, C118S729000

Reexamination Certificate

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06837963

ABSTRACT:
A semiconductor device producing method that can clean an edge part of a semiconductor substrate with certainty is provided. The method of producing a semiconductor device includes a step of generating ions and a step of accelerating the ions by means of an electric field and radiating an ion flow onto an edge part of a semiconductor substrate to clean the edge part of the semiconductor substrate. The semiconductor substrate is moved relative to the ion flow while maintaining a state in which the ion flow is being radiated onto the edge part. The step of generating ions includes applying a high-frequency voltage between a pair of electrodes to generate the ions between the electrodes.

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