Semiconductor device, method of manufacturing the same, and appa

Details Semiconductor device, method of manufacturing the same, and appa Semiconductor device, method of manufacturing the same, and appa

1989-08-04

1991-06-11

Hille, Rolf

357 69, H01L 2304, H01L 2348

Patent

active

050237020

ABSTRACT:
This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can.
In the manufacturing method the manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

REFERENCES:
patent: 3002133 (1961-09-01), Maiden et al.
patent: 3127285 (1964-03-01), Gedgaudas et al.
patent: 3165812 (1965-01-01), Takahashi et al.
patent: 3200311 (1965-08-01), Thomas et al.
patent: 3763403 (1973-10-01), Lootens
patent: 3783347 (1974-01-01), Vladik
patent: 4599636 (1986-07-01), Roberts et al.
Electronics, Book 59, (1986) Aug., No. 29, J. Gosch: "Implosion Package Speeds Diode Production".

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