Semiconductor device, method of manufacturing the same,...

Details Semiconductor device, method of manufacturing the same,... Semiconductor device, method of manufacturing the same,...

2006-12-05

2006-12-05

Lindsay, Jr., Walter L. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000

Reexamination Certificate

active

07144760

ABSTRACT:
A wiring pattern is formed over a semiconductor wafer, in which an interconnect is formed from an integrated circuit, from a pad which is a part of the interconnect, and an external terminal is formed on the wiring pattern. A resin layer is formed on the semiconductor wafer. A mask layer having an opening pattern is formed on the resin layer. A part of the resin layer is removed in a state in which the mask layer is disposed on the resin layer to form an opening in the resin layer. The semiconductor wafer is cut along the opening.

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