Semiconductor device, method of manufacturing the same,...

Details Semiconductor device, method of manufacturing the same,... Semiconductor device, method of manufacturing the same,...

2006-01-03

2006-01-03

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S081000, C257S098000, C257S099000, C257S432000

Reexamination Certificate

active

06982470

ABSTRACT:
A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

REFERENCES:
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5889323 (1999-03-01), Tachibana
patent: 5998862 (1999-12-01), Yamanaka
patent: 6594153 (2003-07-01), Zu et al.
patent: 6727431 (2004-04-01), Hashimoto
patent: 2003/0122137 (2003-07-01), Hashimoto
patent: 2003/0123779 (2003-07-01), Hashimoto
patent: 2003/0124762 (2003-07-01), Hashimoto
patent: 5-110960 (1993-04-01), None

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