Semiconductor device, method of manufacturing the same,...

Details Semiconductor device, method of manufacturing the same,... Semiconductor device, method of manufacturing the same,...

2006-05-02

2006-05-02

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S612000

Reexamination Certificate

active

07037758

ABSTRACT:
The invention provides a method of manufacturing a semiconductor that improves the productivity and the yield of a product, and grinds a semiconductor substrate so that it has almost uniform thickness. The method can include forming a protrusion on a semiconductor substrate having a first area and a second area surrounding the first area. The protrusion protruding above first area. A support being disposed on a surface on which the protrusion is formed, of the semiconductor substrate so that a through hole of the support overlaps with the first area. The semiconductor substrate can be grinded from a surface opposite to the surface on which the protrusion is formed.

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