Semiconductor device, method of forming bump electrode of a semi

Details Semiconductor device, method of forming bump electrode of a semi Semiconductor device, method of forming bump electrode of a semi

1992-05-15

1994-04-26

Desmond, Eugene F.

Fishing, trapping, and vermin destroying

H01L 2144

Patent

active

053066642

ABSTRACT:
A bump electrode of an inexpensive and reliable semiconductor device is provided in which a remaining metal wire portion produced during bump electrode formation is eliminated. The remaining metal wire portion made in a bump electrode forming method for a semiconductor device using a wire bonding technique is pressed and reshaped from above with heat or ultrasonic waves so as to apply pressure and heat to the bump electrode by using a stamping tool.

REFERENCES:
Chip-On-Glass Mounting Technology of LSIs For LCD Module, Yoshihiro Bessho et al. IMC 1990 Proceedings, Tokyo, May 30-Jun. 1, 1990 pp. 183-189.

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