Semiconductor device, method of fabricating the same, and electr

Details Semiconductor device, method of fabricating the same, and electr Semiconductor device, method of fabricating the same, and electr

1999-01-11

2000-05-23

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438110, 438121, 438122, 257701, H01L 2144, H01L 2148, H01L 2150, H01L 2312, H01L 23053

Patent

active

060665122

ABSTRACT:
A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-defective individual packages to each of mounting portions of a plate; and cutting the plate into separate pieces, each of the separated pieces corresponding to each of the mounting portions on which each of the non-defective individual film packages is mounted.

REFERENCES:
patent: 5023202 (1991-06-01), Long
patent: 5083191 (1992-01-01), Ueda
patent: 5442232 (1995-08-01), Goto
patent: 5518964 (1996-05-01), DiStefano
patent: 5661086 (1997-08-01), Nakashima
patent: 5785535 (1998-07-01), Brodsky
patent: 5804872 (1998-09-01), Miyano
patent: 5901041 (1999-05-01), Davies

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