Semiconductor device, method of fabricating the same, and electr

Details Semiconductor device, method of fabricating the same, and electr Semiconductor device, method of fabricating the same, and electr

1998-12-28

2000-05-02

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438464, 257706, 257707, H01L 2144, H01L 2148, H01L 2150, H01L 21326, H01L 21479

Patent

active

060571748

ABSTRACT:
Method of fabricating semiconductor devices comprising the steps of: mounting a plurality of semiconductor chips on a film carrier tape; sealing each one of the semiconductor chips mounted on the film carrier type with epoxy resin; attaching an individual stiffener to the film carrier tape at a position corresponding to each one of the semiconductor chips; forming a plurality of bumps on the film carrier tape at a position corresponding to each one of the semiconductor chips; and punching out the film carrier tape into separate pieces of insulating film after above-described steps. In this method, each step is carried out on the film carrier tape running between supply and take-up reels.

REFERENCES:
patent: 5631497 (1997-05-01), Miyano
patent: 5804872 (1997-02-01), Miyano

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