Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-01-30
2007-01-30
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S111000, C438S112000, C438S113000, C438S114000, C029S025010
Reexamination Certificate
active
09615503
ABSTRACT:
A method of fabricating a semiconductor device comprising: a step (a) of attaching a plurality of semiconductor chips to a tape; a step (b) of cutting the tape; and a step (c) of providing a plurality of external terminals on an insulating film cut from the tape, wherein the steps (a) and (b) are carried out in a reel-to-reel transport system.
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Graybill David E.
Oliff & Berridg,e PLC
Seiko Epson Corporation
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