Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2011-06-28
2011-06-28
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257SE23021, C257SE23069, C438S612000, C438S613000, C438S614000
Reexamination Certificate
active
07969004
ABSTRACT:
In order to realize a semiconductor device which is easily mounted on a circuit board and which has high mounting reliability, a semiconductor device1of the present invention includes: a semiconductor substrate2; and an Au bump3provided on an electrode21. The Au bump3is provided with a projection3a. Also, on a surface of the Au bump3, a solder layer32is formed via a Ni layer31. The projection3amakes it possible to easily mount the semiconductor device1by applying a small weight. Further, even if the amount of solder62supplied on an electrode61on a circuit board6is reduced, it is possible to bond the semiconductor device with a sufficient amount of solder during mounting. Furthermore, because a Ni layer31prevents dissolution of the bump, it is possible to ensure high mounting reliability.
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Clark Jasmine J
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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