Semiconductor device, method for manufacturing the same, and...

Details Semiconductor device, method for manufacturing the same, and... Semiconductor device, method for manufacturing the same, and...

2007-12-05

2010-12-14

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S702000, C257S713000, C257S790000, C257SE23101

Reexamination Certificate

active

07851904

ABSTRACT:
A semiconductor device of the present invention includes: a wiring board4in which a conductive wiring6is formed on an insulating substrate5having an opening5a; a semiconductor element2that has a circuit forming region2aand an electrode pad3, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode3a; a sealing resin7that covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating member9that is disposed so as to have a portion facing the opening; and a filling material8that has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.

REFERENCES:
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patent: 5977633 (1999-11-01), Suzuki et al.
patent: 6097085 (2000-08-01), Ikemizu et al.
patent: 6249046 (2001-06-01), Hashimoto
patent: 6380620 (2002-04-01), Suminoe et al.
patent: 10-41428 (1998-02-01), None

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