Semiconductor device, method for manufacturing the same,...

Details Semiconductor device, method for manufacturing the same,... Semiconductor device, method for manufacturing the same,...

2007-02-13

2007-02-13

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C438S106000, C438S109000

Reexamination Certificate

active

11137704

ABSTRACT:
A semiconductor device includes a first package, a second package, a contact part for electrically coupling a first wiring pattern to a second wiring pattern, and a reinforcer. The thermal expansion coefficient of the first package is larger than that of the second package. The second package is disposed so that the second interposer overlaps the first semiconductor chip and the first interposer. The contact part is provided between the first and second interposers so that a first end is coupled to the first wiring pattern and a second end is coupled to the second wiring pattern. The reinforcer is provided to expose part of the contact part and cover the circumference of the first end of the contact part.

REFERENCES:
patent: 6388333 (2002-05-01), Taniguchi et al.
patent: 6583502 (2003-06-01), Lee et al.
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 06-013541 (1994-01-01), None
patent: 11-8474 (1999-01-01), None
patent: 2001-223297 (2001-08-01), None
patent: 2002-76265 (2002-03-01), None
patent: 2003-318361 (2003-11-01), None
Communication from Japanese Patent Office regarding corresponding application.

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