Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-06-14
2005-06-14
Fahmy, Wael (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S457000
Reexamination Certificate
active
06905911
ABSTRACT:
A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.
REFERENCES:
patent: 5986217 (1999-11-01), Strum
patent: 5994166 (1999-11-01), Akram et al.
patent: 6121689 (2000-09-01), Capote et al.
patent: 6137164 (2000-10-01), Yew et al.
patent: 6271109 (2001-08-01), Weygan et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6396159 (2002-05-01), Shoji
patent: 6414384 (2002-07-01), Lo et al.
patent: 6417027 (2002-07-01), Akram
patent: 6437990 (2002-08-01), Degani et al.
patent: 6518666 (2003-02-01), Ikeda
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 7-240496 (1995-09-01), None
patent: 10-79405 (1998-03-01), None
patent: 10079405 (1998-03-01), None
patent: 11-312712 (1999-11-01), None
patent: 2000-031316 (2000-01-01), None
patent: 2000031316 (2000-01-01), None
patent: 2000-200852 (2000-07-01), None
patent: WO 97/04629 (1997-02-01), None
Hamaguchi Tsuneo
Kagata Kenji
Burns Doane Swecker & Mathis L.L.P.
Dolan Jennifer M.
Fahmy Wael
Mitsubishi Denki & Kabushiki Kaisha
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