Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2007-07-31
2007-07-31
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S686000, C257S777000, C257SE23024, C257SE23025
Reexamination Certificate
active
11412749
ABSTRACT:
A semiconductor device of the present invention comprises a first semiconductor chip that includes a first internal circuit and at least one first conductive pad which is provided on its upper surface and is not connected to the first internal circuit, a second semiconductor chip provided on the first semiconductor chip that includes a second internal circuit and at least one second conductive pad which is provided on its upper surface and is connected to the second internal circuit, at least one first connecting member for connecting between the second semiconductor chip provided on the first semiconductor chip, at least one first conductive pad and at least one second conductive pad, and at least one second connecting member led from at least one first conductive.
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Mandala Jr. Victor A.
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Pert Evan
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